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SCHNEDERLE, P. ADÁMEK, M. SZENDIUCH, I.
Originální název
Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
An important part of the microelectronics manufacturing is the reflow process. Even though that the soldering have a long history, the process is still not completely described. Particular still discussed the introduction of the WEEE Directive 2003/108/EC standards and RoHS Directive 2002/95/EC got the soldering received into new areas. There is a space for new material compositions which do not contain lead. Furthermore, a new procedure process, adjusting of equipment and began to make greater use of nitrogen as protective gas. The aim is to compare the already proven commercial solder alloys on different carrier and evaluate more exactly the benefits of nitrogen atmosphere. The evaluation was performed for solder SAC, Sn100C and SnPb solder paste was used as reference. Type of substrates was printed circuit board FR-4 and ceramic substrate. Soldering conducted in atmosphere with different residual oxygen. Results of this paper may serve to increase the quality of soldering classical package as well as BGA and CSP package.
Klíčová slova
soldering, lead-free, nitrogen
Autoři
SCHNEDERLE, P.; ADÁMEK, M.; SZENDIUCH, I.
Rok RIV
2012
Vydáno
13. 5. 2012
Nakladatel
Vienna University of Technology
Místo
Gusshausstrasse 27- 29, A-1040 WIEN - Austria: IEEE Xplore digital library
ISBN
978-1-4673-2241-6
Kniha
35th International Spring Seminar on Electronics Technology - ISSE 2012 Proceedings
Edice
1
Číslo edice
ISSN
2161-2528
Periodikum
Electronics Technology (ISSE)
Ročník
35
Číslo
Stát
Spojené státy americké
Strany od
201
Strany do
206
Strany počet
5
URL
http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6273139
BibTex
@inproceedings{BUT92353, author="Petr {Schnederle} and Martin {Adámek} and Ivan {Szendiuch}", title="Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders", booktitle="35th International Spring Seminar on Electronics Technology - ISSE 2012 Proceedings", year="2012", series="1", journal="Electronics Technology (ISSE)", volume="35", number="1", pages="201--206", publisher="Vienna University of Technology", address="Gusshausstrasse 27- 29, A-1040 WIEN - Austria: IEEE Xplore digital library", isbn="978-1-4673-2241-6", issn="2161-2528", url="http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6273139" }