Detail publikace

Wire-Bonds Durability in High-Temperature Applications

KLÍMA, M. PSOTA, B. SZENDIUCH, I.

Originální název

Wire-Bonds Durability in High-Temperature Applications

Typ

článek v časopise - ostatní, Jost

Jazyk

angličtina

Originální abstrakt

This work aims to determine the suitability of use of low-temperature co-fired ceramics (LTCC) and thick film technology in applications with semiconductors based on SiC and GaN, which have high operating temperature. Especially, Heraeus HeraLock 2000 substrate is investigated. The paper is mainly focused on the behaviour and reliability of wire-bonds, which are used for connection of the above-mentioned semiconducting devices with a circuit or a package. A test sample was designed for this purpose, which was subjected to thermal load. Subsequently, changes in the bonds resistivity were studied, together with their strength and any defects caused by the thermal load. Other properties, such as termomechanical stress of the material for different temperature profiles were simulated in the ANSYS software. Created mathematical model simulated and compared differences between gold and aluminium wire-bond.

Klíčová slova

wire-bond, wire-bonding, gold, LTCC, low-temperature co-fired ceramic

Autoři

KLÍMA, M.; PSOTA, B.; SZENDIUCH, I.

Rok RIV

2013

Vydáno

18. 11. 2013

ISSN

1802-4564

Periodikum

ElectroScope - http://www.electroscope.zcu.cz

Ročník

2013

Číslo

5

Stát

Česká republika

Strany od

7

Strany do

11

Strany počet

5

BibTex

@article{BUT104704,
  author="Martin {Klíma} and Boleslav {Psota} and Ivan {Szendiuch}",
  title="Wire-Bonds Durability in High-Temperature Applications",
  journal="ElectroScope - http://www.electroscope.zcu.cz",
  year="2013",
  volume="2013",
  number="5",
  pages="7--11",
  issn="1802-4564"
}