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MAJER, Z. PLETZ, M. KRAUTGASSER, C. NÁHLÍK, L. HUTAŘ, P. BERMEJO, R.
Originální název
Numerical Analysis of Sub-Critical Crack Growth in Particulate Ceramic Composites
Typ
článek v časopise ve Web of Science, Jimp
Jazyk
angličtina
Originální abstrakt
The strength of glass or ceramic containing materials can be affected by the environment (stress corrosion). Under applied stress, crack-like defects may grow (sub-critically) for stress intensity factors, KI, below the fracture toughness of the material, KIc. The aim of the present work was to develop a two-dimensional finite element model to analyze the subcritical crack growth behavior of ceramic-based particulate composites. The maximum tangential stress criterion (MTS) was used to predict the direction of the crack propagation, in the framework of linear elastic fracture mechanics. The modeled material was a Low Temperature Co-fired Ceramic (LTCC), containing alumina particles embedded in a glass matrix. The experimentally determined SCCG material behavior (i.e. v-KI data) was implemented in the numerical model. The effect of the elastic modulus of the particles on the subcritical crack propagation was investigated. The conclusions of this paper can contribute to a better understanding of the subcritical propagation of cracks in particulate composites.
Klíčová slova
Fracture Mechanics; Low Temperature Co-fired Ceramics; Micro-crack Propagation; Finite Element Method; Lifetime Estimation
Autoři
MAJER, Z.; PLETZ, M.; KRAUTGASSER, C.; NÁHLÍK, L.; HUTAŘ, P.; BERMEJO, R.
Rok RIV
2014
Vydáno
1. 7. 2014
Nakladatel
ELSEVIER
ISSN
2211-8128
Periodikum
Procedia Materials Science
Ročník
3
Číslo
1
Stát
Nizozemsko
Strany od
2071
Strany do
2076
Strany počet
6
BibTex
@article{BUT109045, author="Zdeněk {Majer} and Martin {Pletz} and Clemens {Krautgasser} and Luboš {Náhlík} and Pavel {Hutař} and Raul {Bermejo}", title="Numerical Analysis of Sub-Critical Crack Growth in Particulate Ceramic Composites", journal="Procedia Materials Science", year="2014", volume="3", number="1", pages="2071--2076", doi="10.1016/j.mspro.2014.06.335", issn="2211-8128" }