Detail publikace

The Vibration Testing as Tool for Optimizing of Two PCB Connection

OTÁHAL, A. PSOTA, B. SZENDIUCH, I.

Originální název

The Vibration Testing as Tool for Optimizing of Two PCB Connection

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This article deals with the use of mechanical testing to optimize the configuration of PCB. Specifically, the system of two connected boards is being investigated under the vibration load. Vibration measurement of such system is compared with the computer simulation and results from both methods are then evaluated including defining the main parameters. This research is related to the European project Board on Board (BOB), which focuses on new technology of two board interconnection, which is dedicated for high density assembly and interconnection.

Klíčová slova

PCB testing, vibration, simulation

Autoři

OTÁHAL, A.; PSOTA, B.; SZENDIUCH, I.

Rok RIV

2015

Vydáno

6. 5. 2015

ISBN

978-963-313-177-0

Kniha

Novel Trends in Electronics Manufacturing - Book of Abtracts 38th International Spring Seminar on Electronics Technology

Strany od

339

Strany do

342

Strany počet

4

URL

https://ieeexplore.ieee.org/abstract/document/7248018

BibTex

@inproceedings{BUT116876,
  author="Alexandr {Otáhal} and Boleslav {Psota} and Ivan {Szendiuch}",
  title="The Vibration Testing as Tool for Optimizing of Two PCB Connection",
  booktitle="Novel Trends in Electronics Manufacturing - Book of Abtracts 38th International Spring Seminar on Electronics Technology",
  year="2015",
  pages="339--342",
  doi="10.1109/ISSE.2015.7248018",
  isbn="978-963-313-177-0",
  url="https://ieeexplore.ieee.org/abstract/document/7248018"
}