Detail publikace

Influence of the PCB Attachment on the Mechanical Properties in Modal Analysis

PSOTA, B. SZENDIUCH, I. OTÁHAL, A.

Originální název

Influence of the PCB Attachment on the Mechanical Properties in Modal Analysis

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This paper is dealing with the influence of the electronic board attachment on its mechanical properties during the vibration load. Different number of screws and their position is investigated through the simulation in Ansys Workbench program. Setup is also verified by the measurement on the vibration table, where the sinus sweep from 10Hz to 2kHz with the 0,3g amplitude will be used.

Klíčová slova

Simulation; PCB; design; ANSYS

Autoři

PSOTA, B.; SZENDIUCH, I.; OTÁHAL, A.

Rok RIV

2015

Vydáno

14. 9. 2015

ISBN

978-0-9568086-1-5

Kniha

Proceedings on 20th European Microelectronics and Packaging Conference & Exhibition

Strany od

1

Strany do

4

Strany počet

4

URL

https://ieeexplore.ieee.org/document/7390679

BibTex

@inproceedings{BUT118145,
  author="Boleslav {Psota} and Ivan {Szendiuch} and Alexandr {Otáhal}",
  title="Influence of the PCB Attachment on the Mechanical Properties in Modal Analysis",
  booktitle="Proceedings on 20th European Microelectronics and Packaging Conference & Exhibition",
  year="2015",
  pages="1--4",
  isbn="978-0-9568086-1-5",
  url="https://ieeexplore.ieee.org/document/7390679"
}