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CASPER, T. DE GERSEM, H. GILLON, R. GÖTTHANS, T. KRATOCHVÍL, T. SCHÖPS, S.
Originální název
Electrothermal simulation of bonding wire degradation under uncertain geometries
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
In this paper, electrothermal field phenomena in electronic components are considered. This coupling is tackled by multiphysical field simulations using the Finite Integration Technique (FIT). In particular, the design of bonding wires with respect to thermal degradation is investigated. Instead of resolving the wires by the computational grid, lumped element representations are introduced as point-to-point connections in the spatially distributed model. Fabrication tolerances lead to uncertainties of the wires' parameters and influence the operation and reliability of the final product. Based on geometric measurements, the resulting variability of the wire temperatures is determined using the stochastic electrothermal field-circuit model.
Klíčová slova
Bonding; Computational modeling; Couplings; Heating; Mathematical model; Thermal conductivity; Wires
Autoři
CASPER, T.; DE GERSEM, H.; GILLON, R.; GÖTTHANS, T.; KRATOCHVÍL, T.; SCHÖPS, S.
Vydáno
14. 3. 2016
Nakladatel
IEEE
Místo
Dresden, Germany
ISBN
978-3-9815370-6-2
Kniha
2016 Design, Automation & Test in Europe Conference & Exhibition (DATE)
Strany od
1297
Strany do
1302
Strany počet
6
URL
https://ieeexplore.ieee.org/document/7459510
BibTex
@inproceedings{BUT124488, author="Thorben {Casper} and Herbert {De Gersem} and Renaud {Gillon} and Tomáš {Götthans} and Tomáš {Kratochvíl} and Sebastian {Schöps}", title="Electrothermal simulation of bonding wire degradation under uncertain geometries", booktitle="2016 Design, Automation & Test in Europe Conference & Exhibition (DATE)", year="2016", pages="1297--1302", publisher="IEEE", address="Dresden, Germany", isbn="978-3-9815370-6-2", url="https://ieeexplore.ieee.org/document/7459510" }