Detail publikace

The Mechanical Strength of Solder Joints on PCB with OSP surface protection

NOVOTNÝ, V. ADÁMEK, M. SKÁCEL, J. ŠANDERA, J. VALA, R.

Originální název

The Mechanical Strength of Solder Joints on PCB with OSP surface protection

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This paper describes some results obtained by the study of influences of different factors which define reliability of solder joints. Generally, these factors include substrate, type of solder paste, soldered components, surface protection of soldering areas and methods of reflowing. In our case, these influences are evaluated with focus on PCB with OSP surface protection under condition of thermal cycling and shear testing. The results from experimental measuring are complemented with computer analysis of models of solder joints and components in ANSYS. Finally, there is evaluation of practical results in conjunction with simulations.

Klíčová slova

Soldering, Lead, Testing, Reliability, Resistors, Finite element analysis, Temperature measurement

Autoři

NOVOTNÝ, V.; ADÁMEK, M.; SKÁCEL, J.; ŠANDERA, J.; VALA, R.

Vydáno

18. 5. 2016

Nakladatel

IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA

Místo

Pilsen, Czech republic

ISBN

978-1-5090-1389-0

Kniha

Proceedings of the International Spring Seminar on Electronics Technology, 39th International Spring Seminar on Electronics Technology, ISSE 2016

Edice

Volume 2016-September

Číslo edice

1

ISSN

2161-2536

Periodikum

International Spring Seminar on Electronics Technology ISSE

Ročník

1

Číslo

1

Stát

Spojené státy americké

Strany od

249

Strany do

253

Strany počet

5

URL

http://ieeexplore.ieee.org.ezproxy.lib.vutbr.cz/document/7563199/authors

BibTex

@inproceedings{BUT125190,
  author="Václav {Novotný} and Martin {Adámek} and Josef {Skácel} and Josef {Šandera} and Radek {Vala}",
  title="The Mechanical Strength of Solder Joints on PCB with OSP surface protection",
  booktitle="Proceedings of the International Spring Seminar on Electronics Technology, 39th International Spring Seminar on Electronics Technology, ISSE 2016",
  year="2016",
  series="Volume 2016-September",
  journal="International Spring Seminar on Electronics Technology ISSE",
  volume="1",
  number="1",
  pages="249--253",
  publisher="IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA",
  address="Pilsen, Czech republic",
  doi="10.1109/ISSE.2016.7563199",
  isbn="978-1-5090-1389-0",
  issn="2161-2536",
  url="http://ieeexplore.ieee.org.ezproxy.lib.vutbr.cz/document/7563199/authors"
}