Detail publikace

Solder Wetting of Substrate Surface in Lead Free Soldering

STARÝ, J., KAZELLE, J.

Originální název

Solder Wetting of Substrate Surface in Lead Free Soldering

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Soldering process containing lead will be substituted by lead-free since 2006. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment). Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Solder wetting is the first phase in physical/chemical influencing of melted solder atoms on connected material surface. Interatomic forces start to work during wetting and these structures rise on all interaface boundary. During wetting process two free surfaces – melted solder and solid metal transform into one interface boundary area This short article is focused on very important part of soldering process – wetting phenomena especially wetting angle and wetting angle hysteresis on different substrates

Klíčová slova

lead free, wetting, surface finish, substrate, flux

Autoři

STARÝ, J., KAZELLE, J.

Rok RIV

2004

Vydáno

16. 6. 2004

Nakladatel

VUT v Brně

Místo

Brno

ISBN

80-214-2701-9

Kniha

The 11th Electronic Devices and Systems Conference

Strany od

394

Strany do

398

Strany počet

5

BibTex

@inproceedings{BUT12620,
  author="Jiří {Starý} and Jiří {Kazelle}",
  title="Solder Wetting of Substrate Surface in Lead Free Soldering",
  booktitle="The 11th Electronic Devices and Systems Conference",
  year="2004",
  pages="5",
  publisher="VUT v Brně",
  address="Brno",
  isbn="80-214-2701-9"
}