Detail publikace

Characterisation of 3D Topography of the Surface Machined by Finishing Technologies of WEDM and Grinding

MOURALOVÁ, K. KOVÁŘ, J. ZAHRADNÍČEK, R. MAN, O.

Originální název

Characterisation of 3D Topography of the Surface Machined by Finishing Technologies of WEDM and Grinding

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Finishing technologies of machining such as grinding or wire electrical discharge machining (WEDM) represent the most frequently used applications when mechanical engineering components that are subject to high requirements for the accuracy of shapes and dimensions as well as quality of machined areas. The study was focused on the evaluation of the machined surface contamination due to grinding and WEDM elements of tool material. In addition, the machined surface morphology was studied using light microscopy, atomic force microscopy (AFM) technique and 3D profilometer. Both area and profile parameters of the surfaces were evaluated by means of two different contactless profilometers based on the principle of coherence correlation interferometry.

Klíčová slova

WEDM; electrical discharge machining; grinding; steel X155CrVMo12-1; surface quality; AFM

Autoři

MOURALOVÁ, K.; KOVÁŘ, J.; ZAHRADNÍČEK, R.; MAN, O.

Vydáno

7. 12. 2016

Nakladatel

Czech Technical University in Prague, Faculty of Electrical Engineering

Místo

Praha

ISBN

978-80-01-05882-4

Kniha

Mechatronika 2016

Strany od

445

Strany do

449

Strany počet

5

URL

http://ieeexplore.ieee.org/abstract/document/7827859/

BibTex

@inproceedings{BUT130149,
  author="Kateřina {Mouralová} and Jiří {Kovář} and Radim {Zahradníček} and Ondřej {Man}",
  title="Characterisation of 3D Topography of the Surface Machined by Finishing Technologies of WEDM and Grinding",
  booktitle="Mechatronika 2016",
  year="2016",
  pages="445--449",
  publisher="Czech Technical University in Prague, Faculty of Electrical Engineering",
  address="Praha",
  isbn="978-80-01-05882-4",
  url="http://ieeexplore.ieee.org/abstract/document/7827859/"
}