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D. Bušek, K. Dušek, D. Růžička, M. Plaček, P. Mach, J. Urbánek, J. Starý
Originální název
Flux effect on void quantity and size in soldered joints
Typ
článek v časopise ve Web of Science, Jimp
Jazyk
angličtina
Originální abstrakt
Article is focused on both macro and microvoids in soldered joints and the use of additional flux to reduce their frequency and minimize their negative effect on the soldered joint reliability. In total five fluxes were used, three were gel based (NC559, MTV-125R, TSF-6516) and two of them were liquid based (Topnik G-5, JBC FL-15). They were used within two solder pastes, both lead and lead-free. The reflow process was identical for all of the combinations and was within the range of manufacturer recommended profiles. The amount of voids was evaluated using X-ray analysis. It was found that the use of increased amount of proper flux, specifically flux with higher activity, in the solder paste may significantly lower the void occurrence.
Klíčová slova
Assembly manufacturing, reliability, soldering, voids, flux
Autoři
Vydáno
1. 5. 2016
Místo
Nizozemsko
ISSN
0026-2714
Periodikum
Microelectronics Reliability
Číslo
60
Stát
Spojené království Velké Británie a Severního Irska
Strany od
135
Strany do
140
Strany počet
6
BibTex
@article{BUT131617, author="David {Bušek} and Karel {Dušek} and Daniel {Růžička} and Martin {Plaček} and Pavel {Mach} and Jan {Urbánek} and Jiří {Starý}", title="Flux effect on void quantity and size in soldered joints ", journal="Microelectronics Reliability", year="2016", number="60", pages="135--140", doi="10.1016/j.microrel.2016.03.009", issn="0026-2714" }