Detail publikace

Analysis of damage of solder joint of heat exchanger

GEJDOŠ, P. KLAKURKOVÁ, L. JULIŠ, M. HORYNOVÁ, M. DYČKOVÁ, L. ŠVEJCAR, J.

Originální název

Analysis of damage of solder joint of heat exchanger

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

The paper focus on the metallographic analysis of damaged heat exchanger made of high-alloy austenitic steel by soldering. The object in question is a soldered joint of main mounting plate of the heat exchanger and first heat exchanging plate of it. In this part of the heat exchanger after the vibration and pressure test crack appeared. The subject of the analysis is the evaluation of the microstructure of the solder joint (high-alloy austenitic steel and copper), and evaluation of the appeared crack. The problematic is solved with aid of metallographic analysis of the microstructure of the material, using light microscopy and scanning electron microscopy and the EDS microanalysis of chemical composition.

Klíčová slova

high-alloy austenitic steel; copper; soldering; heat treatment; microstructure

Autoři

GEJDOŠ, P.; KLAKURKOVÁ, L.; JULIŠ, M.; HORYNOVÁ, M.; DYČKOVÁ, L.; ŠVEJCAR, J.

Vydáno

27. 11. 2017

Nakladatel

Trans Tech Publications

Místo

Switzerland

ISBN

978-80-01-06150-3

Kniha

Přínos metalografie pro řešení výrobních problémů

Edice

14

ISSN

1662-9779

Periodikum

Solid State Phenomena

Ročník

270

Stát

Švýcarská konfederace

Strany od

63

Strany do

67

Strany počet

6

BibTex

@inproceedings{BUT138788,
  author="Pavel {Gejdoš} and Lenka {Klakurková} and Martin {Juliš} and Miroslava {Horynová} and Lucie {Dyčková} and Jiří {Švejcar}",
  title="Analysis of damage of solder joint of heat exchanger",
  booktitle="Přínos metalografie pro řešení výrobních problémů",
  year="2017",
  series="14",
  journal="Solid State Phenomena",
  volume="270",
  pages="63--67",
  publisher="Trans Tech Publications",
  address="Switzerland",
  doi="10.4028/www.scientific.net/SSP.270.63",
  isbn="978-80-01-06150-3",
  issn="1662-9779"
}