Přístupnostní navigace
E-přihláška
Vyhledávání Vyhledat Zavřít
Detail publikace
ŠTEGNEROVÁ, K. MAJER, Z. HUTAŘ, P. NÁHLÍK, L.
Originální název
3D Model of Crack Propagation in Particulate Ceramic Composite Containing Residual Stresses
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
A crack propagation and fracture behaviour of particulate ceramic composite were investigated. Influence of 3D shape of particles on the crack propagation was studied together with influence of the presence of residual stresses, which are developed inside the composite during manufacturing process. Finite element (FE) method was used for numerical simulation of propagating crack in the composite. Basic numerical models of low-temperature co-fired ceramics (LTCC) with alumina particles homogenously dispersed in the glass matrix were developed. Volume fraction of alumina phase was 20vol.%, which is typical amount for LTCC. The results show that existence of residual stresses retards the crack propagating under conditions of sub-critical crack growth (SCG). Presented results contribute to a better understanding of the role of residual stresses in particulate ceramic composites.
Klíčová slova
Ceramic Particulate Composite, Residual Stress, Sub-Critical Crack Growth
Autoři
ŠTEGNEROVÁ, K.; MAJER, Z.; HUTAŘ, P.; NÁHLÍK, L.
Vydáno
2. 1. 2018
Nakladatel
Trans Tech Publications Inc.
Místo
Zürrich, Switzerland
ISBN
9783035713503
Kniha
Advances in Fracture and Damage Mechanics XVI
ISSN
1013-9826
Periodikum
Key Engineering Materials (print)
Ročník
754
Číslo
1
Stát
Švýcarská konfederace
Strany od
103
Strany do
106
Strany počet
4
URL
https://www.scientific.net/KEM.754.103
BibTex
@inproceedings{BUT141450, author="Kateřina {Štegnerová} and Zdeněk {Majer} and Pavel {Hutař} and Luboš {Náhlík}", title="3D Model of Crack Propagation in Particulate Ceramic Composite Containing Residual Stresses", booktitle="Advances in Fracture and Damage Mechanics XVI", year="2018", journal="Key Engineering Materials (print)", volume="754", number="1", pages="103--106", publisher="Trans Tech Publications Inc.", address="Zürrich, Switzerland", doi="10.4028/www.scientific.net/KEM.754.103", isbn="9783035713503", issn="1013-9826", url="https://www.scientific.net/KEM.754.103" }