Detail publikace

Modular Framework for Detection of Inter-ictal Spikes in iEEG

KEŠNER, F. SEKANINA, L. BRÁZDIL, M.

Originální název

Modular Framework for Detection of Inter-ictal Spikes in iEEG

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

In this paper, we present a new modular approach for detection of inter-ictal spikes in intracranial iEEG recordings from patients that are suffering from pharmaco-resistant form of epilepsy. This new approach is presented in the form of a detection framework consisting of three primary modules: first level detector, second level feature extractor, and third level detection classifier, where each module is responsible for a specific functionality. This detection framework can be perceived as a three slot system, where modules can be easily plugged in their slots and replaced by a different module or implementation on demand, in order to adapt the quality of detection (measured in terms of sensitivity, precision or inter-recording adaptability) and computational cost. Using complex real-world data sets it was confirmed that the proposed framework provides highly sensitive and precise detection, while it also significantly reduces the computation time. 

Klíčová slova

Detectors, Electroencephalography, Epilepsy, Feature extraction, Indexes, Sensitivity, Standards

Autoři

KEŠNER, F.; SEKANINA, L.; BRÁZDIL, M.

Vydáno

1. 2. 2017

Nakladatel

Institute of Electrical and Electronics Engineers

Místo

Los Alamos

ISBN

978-1-5090-2809-2

Kniha

The 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC'17)

Strany od

418

Strany do

421

Strany počet

4

URL

https://www.fit.vut.cz/research/publication/11333/

BibTex

@inproceedings{BUT144409,
  author="Filip {Kešner} and Lukáš {Sekanina} and Milan {Brázdil}",
  title="Modular Framework for Detection of Inter-ictal Spikes in iEEG",
  booktitle="The 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC'17)",
  year="2017",
  pages="418--421",
  publisher="Institute of Electrical and Electronics Engineers",
  address="Los Alamos",
  doi="10.1109/EMBC.2017.8036851",
  isbn="978-1-5090-2809-2",
  url="https://www.fit.vut.cz/research/publication/11333/"
}