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Detail publikace
BULVA, J., NOVOTNÝ, M., SZENDIUCH, I.
Originální název
Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
This paper describes theory of solder joint reliability and thermomechanical modelling of connection of two different materials, which are often used in electronic devices – organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.
Klíčová slova v angličtině
ANSYS, modelling, reliability, Lead-free
Autoři
Rok RIV
2005
Vydáno
1. 1. 2005
Nakladatel
IMAPS BENELUX
Místo
Brugge, Belgium
Strany od
546
Strany do
1095
Strany počet
550
BibTex
@inproceedings{BUT14828, author="Jindřich {Bulva} and Marek {Novotný} and Ivan {Szendiuch}", title="Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling", booktitle="15th European Microelectronics and Packaging Conference & Exhibition", year="2005", pages="550", publisher="IMAPS BENELUX", address="Brugge, Belgium" }