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HALABUK, D. NÁVRAT, T.
Originální název
The effect of third principal stress in the measurement of residual stresses by hole-drilling method
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
One of the most popular and widely used technique for measuring residual stresses is the hole-drilling method. By this method, it is possible to evaluate only biaxial residual stresses located in plane parallel to the surface, but some processes produce a triaxial stress state. For this reason, the evaluation of triaxial stress state by the method used for biaxial state was assessed in this paper. A hole-drilling experiment was simulated by the finite element method for two different stress states. The first stress state considered constant residual stresses in all directions. The second one considered constant residual stresses in a plane parallel to the surface and the residual stress in a direction perpendicular to the surface was equal to zero on the surface and increased with depth. Both states were simulated for various ratios of stress in a direction perpendicular to the stresses in plane. The obtained results show that residual stress in a perpendicular direction affects the evaluation of residual stresses in plane. If the residual stress in the perpendicular direction is high compared to stresses in plane, the error produced by the evaluation of triaxial stress state by the method for biaxial stress state can also be high.
Klíčová slova
residual stress, hole-drilling method, third principal stress, ASTM E837-13
Autoři
HALABUK, D.; NÁVRAT, T.
Vydáno
26. 11. 2018
Nakladatel
EDP Sciences
ISSN
2261-236X
Periodikum
MATEC Web of Conferences
Ročník
237
Stát
Francouzská republika
Strany od
1
Strany do
6
Strany počet
BibTex
@inproceedings{BUT151476, author="Dávid {Halabuk} and Tomáš {Návrat}", title="The effect of third principal stress in the measurement of residual stresses by hole-drilling method", booktitle="MATEC Web of Conferences", year="2018", journal="MATEC Web of Conferences", volume="237", pages="1--6", publisher="EDP Sciences", doi="10.1051/matecconf/201823701012", issn="2261-236X" }