Detail publikace

In-depth Analysis of 10 nm Exynos Processor using Micro CT and FIB-SEM System

SHARANG, S. DLUHOŠ, J. KALASOVÁ, D. DENISYUK, A. VÁŇA, R. ZIKMUND, T. KAISER, J. OBONA, J.

Originální název

In-depth Analysis of 10 nm Exynos Processor using Micro CT and FIB-SEM System

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Latest technology nodes have made finer, more precise physical failure analysis techniques to emerge. Conventional techniques for larger technology nodes are slowly becoming ineffective. In this paper, we discuss effective yet non-invasive technique like micro CT where we get high fidelity images of the Exynos processor and complement it with further analysis using FIB-SEM systems-based preparation techniques like site-specific homogenous delayering, in-situ probing and TEM lamella preparation which enables failure analysis and reverse engineering techniques like nanoprobing and TEM imaging possible.

Klíčová slova

Delayering, Micro CT, TEM, FIB-SEM, Nanoprobing.

Autoři

SHARANG, S.; DLUHOŠ, J.; KALASOVÁ, D.; DENISYUK, A.; VÁŇA, R.; ZIKMUND, T.; KAISER, J.; OBONA, J.

Vydáno

2. 7. 2019

ISBN

978-1-7281-3552-6

Kniha

IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

Strany od

1

Strany do

4

Strany počet

4

URL

http://www.ipfa-ieee.org/

BibTex

@inproceedings{BUT157871,
  author="S. {Sharang} and Jiří {Dluhoš} and Dominika {Kalasová} and Andrey {Denisyuk} and Rostislav {Váňa} and Tomáš {Zikmund} and Jozef {Kaiser} and Jozef Vincenc {Obona}",
  title="In-depth Analysis of 10 nm Exynos Processor using Micro CT and FIB-SEM System",
  booktitle="IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits",
  year="2019",
  pages="1--4",
  isbn="978-1-7281-3552-6",
  url="http://www.ipfa-ieee.org/"
}