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SZENDIUCH, I. HURBAN, M.
Originální název
Measurement of Gas Flow in Reflow Oven
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
Measuring of gas flow inside of an reflow furnace is very important issue, helping to optimize heat transfer and decrease power consumption of such machine. Nowadays we are using lead free solder alloys and optimized profiling is a must for high quality of soldering joints and as low as possible void rate. Mostly in medical and automotive branches are these technological methods very important. Our target is reliable production, it means reliable products. This is the basics for longer lifetime of electronics at all. Measuring equipment for 3D measuring of a gas flow is one of very important things to reach this target.
Klíčová slova
Reflow soldering, heat transfer coefficient, gas flow velocity, CTA.
Autoři
SZENDIUCH, I.; HURBAN, M.
Vydáno
8. 5. 2019
Nakladatel
IEEE Computer Society
Místo
Wroclaw, Poland
ISBN
9781538657300
Kniha
2019 42nd International Spring Seminar on Electronics Technology (ISSE)
Edice
Institute of Electrical andElectronics Engineering (IEEE)
ISSN
2161-2536
Periodikum
International Spring Seminar on Electronics Technology ISSE
Ročník
1
Číslo
Stát
Spojené státy americké
Strany od
151
Strany do
154
Strany počet
3
URL
http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=8000919
BibTex
@inproceedings{BUT158383, author="Ivan {Szendiuch} and Milan {Hurban}", title="Measurement of Gas Flow in Reflow Oven", booktitle="2019 42nd International Spring Seminar on Electronics Technology (ISSE)", year="2019", series="Institute of Electrical andElectronics Engineering (IEEE)", journal="International Spring Seminar on Electronics Technology ISSE", volume="1", number="1", pages="151--154", publisher="IEEE Computer Society", address="Wroclaw, Poland", doi="10.1109/ISSE.2019.8810150", isbn="9781538657300", issn="2161-2536", url="http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=8000919" }