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ZACH, J. PETERKOVÁ, J. BUBENÍK, J.
Originální název
Study of behaviour of thermal insulation materials under extremely low pressure
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
In most thermal insulation materials, reduced internal pressure improves thermal insulation properties. It reduces heat transport by convection as well as heat conduction in gases in the material´s pore structure. The dependence of thermal conductivity on pressure is individual to every type of insulation with open porosity. In general, a material with fine porosity is not very sensitive to pressure change within the range of very low pressure to vacuum. On the other hand, materials with a larger number of bigger pores are more sensitive to changing pressure. Any pressure change between atmosphere pressure and vacuum causes a change in thermal conductivity. The paper presents the results of an investigation into the behaviour of alternative fibrous insulations usable in the production of vacuum insulation panels at low pressure.
Klíčová slova
Thermal insulation materials; porosity; vacuum; low pressure; thermal conductivity.
Autoři
ZACH, J.; PETERKOVÁ, J.; BUBENÍK, J.
Vydáno
2. 9. 2019
Nakladatel
EDP Sciences
Místo
Francie
ISSN
2261-236X
Periodikum
MATEC Web of Conferences
Ročník
282
Číslo
1
Stát
Francouzská republika
Strany od
Strany do
6
Strany počet
URL
https://www.matec-conferences.org/articles/matecconf/pdf/2019/31/matecconf_cesbp2019_02044.pdf
Plný text v Digitální knihovně
http://hdl.handle.net/11012/196378
BibTex
@inproceedings{BUT158999, author="Jiří {Zach} and Jitka {Peterková} and Jan {Bubeník}", title="Study of behaviour of thermal insulation materials under extremely low pressure", booktitle="4th Central European Symposium on Building Physics (CESBP 2019)", year="2019", journal="MATEC Web of Conferences", volume="282", number="1", pages="1--6", publisher="EDP Sciences", address="Francie", doi="10.1051/matecconf/201928202044", issn="2261-236X", url="https://www.matec-conferences.org/articles/matecconf/pdf/2019/31/matecconf_cesbp2019_02044.pdf" }