Detail publikace

The AQUAS ECSEL Project Aggregated Quality Assurance for Systems: Co-Engineering Inside and Across the Product Life Cycle

POMANTE, L. MUTTILLO, V. KŘENA, B. VOJNAR, T. VELJKOVIĆ, F. MAGNIN, P. MATSCHNIG, M. FISCHER, B. MARTINEZ, J. GRUBER, T.

Originální název

The AQUAS ECSEL Project Aggregated Quality Assurance for Systems: Co-Engineering Inside and Across the Product Life Cycle

Typ

článek v časopise ve Web of Science, Jimp

Jazyk

angličtina

Originální abstrakt

There is an ever-increasing complexity of the systems we engineer in modern society, which includes facing the convergence of the embedded world and the open world. This complexity creates increasing difficulty with providing assurance for factors including safety, security and performance. In such a context, the AQUAS project investigates the challenges arising from e.g., the inter-dependence of safety, security and performance of systems and aims at efficient solutions for the entire product life-cycle. The project builds on knowledge of partners gained in current or former EU projects and will demonstrate the newly developed methods and techniques for co-engineering across use cases spanning Aerospace, Medicine, Transport and Industrial Control.

Klíčová slova

Cyber-physical systems, Safety, Security, Performance, Co-engineering, Product life-cycle

Autoři

POMANTE, L.; MUTTILLO, V.; KŘENA, B.; VOJNAR, T.; VELJKOVIĆ, F.; MAGNIN, P.; MATSCHNIG, M.; FISCHER, B.; MARTINEZ, J.; GRUBER, T.

Vydáno

1. 9. 2019

ISSN

0141-9331

Periodikum

Microprocessors and Microsystems

Ročník

2019

Číslo

69

Stát

Nizozemsko

Strany od

54

Strany do

67

Strany počet

14

URL

https://www.sciencedirect.com/science/article/pii/S014193311930047X

BibTex

@article{BUT162302,
  author="POMANTE, L. and MUTTILLO, V. and KŘENA, B. and VOJNAR, T. and VELJKOVIĆ, F. and MAGNIN, P. and MATSCHNIG, M. and FISCHER, B. and MARTINEZ, J. and GRUBER, T.",
  title="The AQUAS ECSEL Project Aggregated Quality Assurance for Systems: Co-Engineering Inside and Across the Product Life Cycle",
  journal="Microprocessors and Microsystems",
  year="2019",
  volume="2019",
  number="69",
  pages="54--67",
  doi="10.1016/j.micpro.2019.05.013",
  issn="0141-9331",
  url="https://www.sciencedirect.com/science/article/pii/S014193311930047X"
}