Detail publikace

Usage of offset printing technology for printed electronics and smart labels

KERNDL, M. ŠTEFFAN, P.

Originální název

Usage of offset printing technology for printed electronics and smart labels

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Printed electronics is key segment in modern fabrication of ultra-low-cost RFID/NFC/RF tags, smart labels, packaging, sensors etc. This paper shows the opportunity of usage of well known printing process called "offset printing" or "offset lithography". It is widely spread and well developed industry, but rarely used for printed electronics and smart tags. This work proposes usage of offset press on variety of substrates at high speed and large capacity production of printed electronics and also points to a connection of a lot of post-press technologies such as foil lamination, cutting, die-cutting, embossing, gluing etc. This additive technology provides an open door for smart packaging manufacturing, simply the RFID antenna can be printed by offset press directly on the substrate (usually paper) that is forming the box, smart label or sticker. Variety of substrates is also well maintained, offset press is usually equipped with UV, IR or hot air drying units, that enables printing on flexible substrates. More printing units also provides the technological possibility of layers overprinting.

Klíčová slova

Printed electronics; RFID; NFC; IoT; offset print

Autoři

KERNDL, M.; ŠTEFFAN, P.

Vydáno

6. 7. 2020

ISBN

978-1-7281-6376-5

Kniha

43rd International Conference on Telecommunications and Signal Processing

Strany od

657

Strany do

659

Strany počet

3

URL

BibTex

@inproceedings{BUT163985,
  author="Michal {Kerndl} and Pavel {Šteffan}",
  title="Usage of offset printing technology for printed electronics and smart labels",
  booktitle="43rd International Conference on Telecommunications and Signal Processing",
  year="2020",
  pages="657--659",
  isbn="978-1-7281-6376-5",
  url="https://tsp.vutbr.cz/datas/tsp2020/TSP2020.pdf"
}