Detail publikace

Plastic Replacements: Win or Loss?

Klemeš, J.J., Van Fan, Y.

Originální název

Plastic Replacements: Win or Loss?

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

The plastic, more correctly to be addressed as polymers, are becoming a hot topic in media and also research. The plastics have been branded sometimes as an evil, which has to be replaced, in some cases at any cost. However, a coldblooded analysis and assessment are needed comparing all pros and cons based on environmental footprints quantification with full life cycle assessment. This should include assessment of possible health risks, consumed energy, released emissions and effluents, as well as consumption of raw materials, water and dealing with the wastewater. The assessment of recyclability, reprocessing and environmental burden is needed. The work tends to contribute to the discussion of what recommendations should be developed to the industry and business to minimise the environmental impacts. A Plastic Footprint has been assessed, and a novel Plastic Waste Footprint introduced. © 2020 University of Split, FESB.

Klíčová slova

assessment of management; emissions and plastic waste footprints; plastic; pollution; waste treatment

Autoři

Klemeš, J.J., Van Fan, Y.

Vydáno

23. 9. 2020

Nakladatel

Institute of Electrical and Electronics Engineers Inc.

ISBN

9789532901054

Kniha

2020 5th International Conference on Smart and Sustainable Technologies, SpliTech 2020

Strany od

9243775

Strany do

9243775

Strany počet

13

URL

https://ieeexplore.ieee.org/document/9243775

BibTex

@inproceedings{BUT168197,
  author="Jiří {Klemeš} and Yee Van {Fan}",
  title="Plastic Replacements: Win or Loss?",
  booktitle="2020 5th International Conference on Smart and Sustainable Technologies, SpliTech 2020",
  year="2020",
  pages="9243775--9243775",
  publisher="Institute of Electrical and Electronics Engineers Inc.",
  doi="10.23919/SpliTech49282.2020.9243775",
  isbn="9789532901054",
  url="https://ieeexplore.ieee.org/document/9243775"
}