Detail publikace

Phase change material for thermal management of IC packages

FIALA, P. STEINBAUER, M.

Originální název

Phase change material for thermal management of IC packages

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This paper deals with the application of phase change materials (PCM) for thermal management of integrated circuits as a viable alternative to active forced convection cooling systems.The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D which is applied to inorganic crystalline salts. There are also results of numerical simulation of real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally.

Klíčová slova

phase change, FEM, heat, integrated circuit

Autoři

FIALA, P.; STEINBAUER, M.

Rok RIV

2007

Vydáno

10. 9. 2007

Nakladatel

University of West Bohemia

Místo

Plzeň

ISBN

978-80-7043-564-9

Kniha

AMTEE 07

Strany od

3

Strany do

4

Strany počet

2

BibTex

@inproceedings{BUT23674,
  author="Pavel {Fiala} and Miloslav {Steinbauer}",
  title="Phase change material for thermal management of IC packages",
  booktitle="AMTEE 07",
  year="2007",
  pages="3--4",
  publisher="University of West Bohemia",
  address="Plzeň",
  isbn="978-80-7043-564-9"
}