Detail publikace

Quality evaluation software of the soldered connection

PAVLÍK, M.

Originální název

Quality evaluation software of the soldered connection

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This paper deals with special software for real time testing and consequently archiving pictures of the soldered connection. Described tools provide detection of the soldered connection quality wrong soldered SMD. Software also shows angle of the soldered connection and is able to calculate deviation from the standard.

Klíčová slova

SMD soldering, package placing

Autoři

PAVLÍK, M.

Rok RIV

2008

Vydáno

23. 4. 2008

Nakladatel

Publishing House of Izevsk State Technical University

Místo

Izevsk

ISBN

978-5-7526-0355-6

Kniha

First Forum of Young Researchers Proceedings

Edice

1

Číslo edice

1

Strany od

316

Strany do

320

Strany počet

5

BibTex

@inproceedings{BUT26584,
  author="Michal {Pavlík}",
  title="Quality evaluation software of the soldered connection",
  booktitle="First Forum of Young Researchers Proceedings",
  year="2008",
  series="1",
  number="1",
  pages="316--320",
  publisher="Publishing House of Izevsk State Technical University",
  address="Izevsk",
  isbn="978-5-7526-0355-6"
}