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NICÁK, M. SZENDIUCH, I.
Originální název
CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
This paper describes design, construction and some test results of lead-free soldered three dimensional structures based on combination of stacked thick-film Al2O3 and FR-4 substrates. These various substrate configurations are realized in two ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls.
Klíčová slova
packaging, stacking, 3D structures, lead-free, thick-film
Autoři
NICÁK, M.; SZENDIUCH, I.
Rok RIV
2010
Vydáno
22. 4. 2010
Nakladatel
Publishing House of ISTU
Místo
Izhevsk, Russia
ISBN
978-5-7526-0442-3
Kniha
Second Forum of Young Researchers. In the framework of International Forum "Education Quality - 2010" : Proceedings
Strany od
378
Strany do
382
Strany počet
444
BibTex
@inproceedings{BUT33965, author="Michal {Nicák} and Ivan {Szendiuch}", title="CONTRIBUTION TO LEAD-FREE SOLDERED 3D STRUCTURES", booktitle="Second Forum of Young Researchers. In the framework of International Forum {"}Education Quality - 2010{"} : Proceedings", year="2010", pages="378--382", publisher="Publishing House of ISTU", address="Izhevsk, Russia", isbn="978-5-7526-0442-3" }