Detail publikace

Anodic bonding process in MEMS applications

PEKÁREK, J. VRBA, R. MAGÁT, M.

Originální název

Anodic bonding process in MEMS applications

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Anodic bonding is a method for joining glass to silicon. It is one of the important steps for packaging MEMS components. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the colour to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass.

Klíčová slova

Anodic bonding, packaging, micro electro-mechanical systems (MEMS).

Autoři

PEKÁREK, J.; VRBA, R.; MAGÁT, M.

Rok RIV

2010

Vydáno

30. 8. 2010

Nakladatel

Brno University of Technology, Faculty of Electrical Engineering and Communication

Místo

Tiskárna Atom, Ltd. Chuchelna 254, Semily

ISBN

978-80-214-4139-2

Kniha

Proceedings of 8th international conference KRÁLÍKY 2010

Číslo edice

1.

Strany od

103

Strany do

105

Strany počet

3

BibTex

@inproceedings{BUT34624,
  author="Jan {Pekárek} and Radimír {Vrba} and Martin {Magát}",
  title="Anodic bonding process in MEMS applications",
  booktitle="Proceedings of 8th international conference KRÁLÍKY 2010",
  year="2010",
  number="1.",
  pages="103--105",
  publisher="Brno University of Technology, Faculty of Electrical Engineering and Communication",
  address="Tiskárna Atom, Ltd.
Chuchelna 254, Semily",
  isbn="978-80-214-4139-2"
}