Detail publikace

Wetting Characteristics Study of Soldering Process in Nitrogen and Nitrogen/Hydrogen Atmosphere

STARÝ, J., KAZELLE, J.

Originální název

Wetting Characteristics Study of Soldering Process in Nitrogen and Nitrogen/Hydrogen Atmosphere

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and PCBs and optimized soldering process settings. Since 2006 lead solder will be substituted by lead-free. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment). Inert/inert-reduction atmosphere have to improve solder process yield effect. This short article is focused on very important part of soldering process – wetting phenomena

Klíčová slova

lead free, solderability. wettability, surface finish, flux, nitrogen, forming gas

Autoři

STARÝ, J., KAZELLE, J.

Rok RIV

2003

Vydáno

1. 1. 2003

Nakladatel

VUT v Brně

Místo

Brno

ISBN

80-214-2452-4

Kniha

Electronic Devices and Systems EDS 03

Číslo edice

první

Strany od

438

Strany do

441

Strany počet

4

BibTex

@inproceedings{BUT8886,
  author="Jiří {Starý} and Jiří {Kazelle}",
  title="Wetting Characteristics Study of Soldering Process in Nitrogen and Nitrogen/Hydrogen Atmosphere",
  booktitle="Electronic Devices and Systems EDS 03",
  year="2003",
  number="první",
  pages="4",
  publisher="VUT v Brně",
  address="Brno",
  isbn="80-214-2452-4"
}