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SZENDIUCH, I.
Originální název
Lead-free Soldering - when will be comming?
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
The first supposed date for replacing of lead-solders was January 1, 2004. We all can see that the reality is still distant and nobody is sure that it will be actually announced year 2006. There is no current definition of lead-free in electronics industry. However based on environmental restrictions, manufacturer requirements and industrial practice, the amount of lead contained in a lead-free alloy should be less than 0.1%. A large number of lead-free solders have been developed and applications have been made for over 100 patents on various alloy compositions. Although not all these alloys are commercially available there is still a wide range to choose from. Unfortunately within this range of lead-free solders, there is no absolute drop-in replacement for tin-lead alloy. It other words there is no lead-free alloy with the same melting temperature, wetting, cost and strength properties.
Klíčová slova
Solder-Free, Soldering, Factors, Parameters
Autoři
Rok RIV
2003
Vydáno
25. 9. 2003
Nakladatel
Technological Institute of Crete
Místo
Crete, Greece
ISBN
80-214-2461-3
Kniha
Proceedings of the Socrates Workshop 2003
Strany od
61
Strany do
65
Strany počet
5
BibTex
@inproceedings{BUT9233, author="Ivan {Szendiuch}", title="Lead-free Soldering - when will be comming?", booktitle="Proceedings of the Socrates Workshop 2003", year="2003", volume="2003", pages="5", publisher="Technological Institute of Crete", address="Crete, Greece", isbn="80-214-2461-3" }