Detail publikace

Zero Shrink LTCC 3D Structure Interconnections

NICÁK, M. PSOTA, B. STARÝ, J. ŠANDERA, J. KOSINA, P.

Originální název

Zero Shrink LTCC 3D Structure Interconnections

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This paper describes design, construction and some recent tests of three dimensional stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting zero shrink Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching.

Klíčová slova

LTCC, soldering, leaching, structure, interconnection

Autoři

NICÁK, M.; PSOTA, B.; STARÝ, J.; ŠANDERA, J.; KOSINA, P.

Rok RIV

2012

Vydáno

13. 5. 2012

Nakladatel

IEEE Xplore digital library

Místo

Vienna University of Technology Gusshausstrasse 27-29 A-1040 WIEN - Austria

ISBN

978-1-4673-2241-6

Kniha

2012 35th International Spring Seminar on Electronics Technology (ISSE)

ISSN

2161-2528

Periodikum

Electronics Technology (ISSE)

Ročník

35

Číslo

1

Stát

Spojené státy americké

Strany od

128

Strany do

132

Strany počet

4

URL

http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6273122

BibTex

@inproceedings{BUT93447,
  author="Michal {Nicák} and Boleslav {Psota} and Jiří {Starý} and Josef {Šandera} and Petr {Kosina}",
  title="Zero Shrink LTCC 3D Structure Interconnections",
  booktitle="2012 35th International Spring Seminar on Electronics Technology (ISSE)",
  year="2012",
  journal="Electronics Technology (ISSE)",
  volume="35",
  number="1",
  pages="128--132",
  publisher="IEEE Xplore digital library",
  address="Vienna University of Technology
Gusshausstrasse 27-29
A-1040 WIEN - Austria",
  isbn="978-1-4673-2241-6",
  issn="2161-2528",
  url="http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6273122"
}