Detail publikace

Effect of nitrogen atmosphere on the quality of lead-free solder joints

SCHNEDERLE, P. ADÁMEK, M. SZENDIUCH, I.

Originální název

Effect of nitrogen atmosphere on the quality of lead-free solder joints

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Reflow process is an important part of the microelectronics manufacturing. Still discussed the introduction of the WEEE Directive 2003/108/EC standards and RoHS Directive 2002/95/EC got the soldering into new areas. There is a space for new material compositions which do not contain lead, new procedure process, device setting, and began to make greater use of protective atmosphere. This article is focus on nitrogen protective atmosphere. Soldering was made on alumina substrate with conductive motive created by silver paste without surface finish. Solder paste SAC305, Sn100C, SnAgCuBiIn was used and paste SnPbAg as reference. A measurement of wetting and visual inspection according IPC-610 was used to evaluate the influence of nitrogen atmosphere. Comparison between alumina and FR-4 with NiAu surface finish is shown at the end of paper.

Klíčová slova

Nitrogen, atmosphere, alumina, lead-free solder

Autoři

SCHNEDERLE, P.; ADÁMEK, M.; SZENDIUCH, I.

Rok RIV

2012

Vydáno

28. 6. 2012

Nakladatel

Ing. Vladislav Pokorný - LITERA, Tábor 43a, 612 00 Brno

Místo

Brno

ISBN

978-80-214-4539-0

Kniha

EDS 12 IMAPS CS INTERNATIONAL CONFERENCE PROCEEDINGS

Edice

1

Číslo edice

1

Strany od

308

Strany do

313

Strany počet

6

BibTex

@inproceedings{BUT95900,
  author="Petr {Schnederle} and Martin {Adámek} and Ivan {Szendiuch}",
  title="Effect of nitrogen atmosphere on the quality of lead-free solder joints",
  booktitle="EDS 12 IMAPS CS INTERNATIONAL CONFERENCE PROCEEDINGS",
  year="2012",
  series="1",
  number="1",
  pages="308--313",
  publisher="Ing. Vladislav Pokorný - LITERA, Tábor 43a, 612 00 Brno",
  address="Brno",
  isbn="978-80-214-4539-0"
}