Czech Science Foundation - Standardní projekty

- whole funder

GA102/00/0969

Czech

Bazalka Michal, Ing. - fellow researcher
Bílek Jaromír, Ing. - fellow researcher
Malysz Karel, Ing. - fellow researcher
Prášek Jan, Ing., Ph.D. - fellow researcher
Szendiuch Ivan, doc. Ing., CSc. - principal person responsible

Department of Microelectronics
- (2000-01-01 - 2000-12-31)

SZENDIUCH, I. Wafer-level packaging vs. chip-level Packaging. In Intensive Training Programme in Electronic System Design, Proceedings. Brno: Ing. Zdeněk Novotný, 2001. p. 54 ( p.)
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ADÁMEK, M., KREJČÍ, J., SZENDIUCH, I. The Dependance of TFT Chemical Sensors on the Technology of Preparation Methods of Testing. In Proceedings of 34th IMAPS Interantional Sympozium. Baltimore, USA: IMAPS USA, 2001. p. 688-692. ISBN: 0-930815-64-5.
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SZENDIUCH, I. New Approach to Quality Control in Small Electrotechnical Companies. In Proceedings IMAPS Strabourg 2001. Strasbourg: IMAPS Europe, 2001. p. 422 ( p.)ISBN: 80-238-5509-3.
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HLAVÁČ, R., SZENDIUCH, I. Lead-Free Implementation Issue. In Intensive Trainning Programme in Electronic System Design. Brno: Ing. Zdeněk Novotný, 2001. p. 54 ( p.)ISBN: 80-214-2027-8.
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BÍLEK, J., SZENDIUCH, I. Model of Temperature Distribution of Thick Film Heating Element. In Electronic Devices and Systems 2001. Brno, Czech Republic: Ing. Zdeněk Novotný, CSc., Brno, 2001. p. 248 ( p.)ISBN: 80-214-1960-1.
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SZENDIUCH, I. a kol. Technologie elektronických obvodů a systémů. GA102/00/0969. GA102/00/0969. Brno: Nakladatelství VUTIUM, Brno, 2002. 289 s. ISBN: 80-214-2072-3.
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ADÁMEK, M., KREJČÍ, J. The thick film microelectrodes. In Electronic Devices and Systems EDS' 01 Proceedings. Neuveden. Brno: 2001. p. 253-256. ISBN: 80-214-1960-1.
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ADÁMEK, M. The Behavior and Properties of TFT Platinum Electrodes Measured on the Electrochemical Workstation AEW2–10. In Proceedings of 7th Conference STUDENT FEI 2001. Brno: Vysoké učení technické v Brně, 2001. p. 114 ( p.)ISBN: 80-214-1860-5.
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SZENDIUCH, I. K některým otázkám souvisejícím s problematikou součástek 0201. 2001, roč. 02, č. 01, s. 9 ( s.)
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SZENDIUCH, I. Chip Level Packaging - New Way to Higher Integration. 2001, vol. 06, no. 33, p. 9 ( p.)
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ADÁMEK, M., KREJČÍ, J., SZENDIUCH, I. Temperature characteristic of thick film sensors and biosensors. In IMAPS - EUROPE PRAGUE 2000, Symposium Proceedings. Neuveden. Praha: 2000. p. 379-382. ISBN: 80-238-5509-3.
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