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Publication detail
ŠANDERA, J. NICÁK, M.
Original Title
Temperature cycling with Peltier elements of boards with SMD components and failure evaluation
English Title
Type
journal article in Web of Science
Language
Czech
Original Abstract
This article aims to discuss the construction of a system for temperature cycling, where Peltier elements are used as heating or cooling elements.This article describes the results and experiences based on several years of practice in the area of thermo-mechanical reliability of soldered joints on printed boards with SMD components.
English abstract
Keywords
Assembly, Fatigue, SMD, Thermal fatigue
Key words in English
Authors
ŠANDERA, J.; NICÁK, M.
Released
27. 3. 2014
Publisher
Emerald Group Publishing Limited
Location
England
ISBN
0954-0911
Periodical
SOLDERING & SURFACE MOUNT TECHNOLOGY
Year of study
26
Number
2
State
United Kingdom of Great Britain and Northern Ireland
Pages from
53
Pages to
61
Pages count
8
URL
https://www.emerald.com/insight/content/doi/10.1108/SSMT-02-2013-0004/full/html
BibTex
@article{BUT106754, author="Josef {Šandera} and Michal {Nicák}", title="Temperature cycling with Peltier elements of boards with SMD components and failure evaluation", journal="SOLDERING & SURFACE MOUNT TECHNOLOGY", year="2014", volume="26", number="2", pages="53--61", doi="10.1108/SSMT-02-2013-0004", issn="0954-0911", url="https://www.emerald.com/insight/content/doi/10.1108/SSMT-02-2013-0004/full/html" }