Publication detail

Detekce poruch pájeného spoje

VEJMOLA, T. ŠANDERA, J.

Original Title

Detekce poruch pájeného spoje

English Title

Detection of Solder Joint Defects

Type

journal article - other

Language

Czech

Original Abstract

Článek popisuje systém identifikace poruch na pájených spojích, jeho použití a princip.

English abstract

Article describes system identification failures of soldered joints

Key words in English

Systém, DPS, detekce, plošné spoje, chyby

Authors

VEJMOLA, T.; ŠANDERA, J.

RIV year

2014

Released

11. 2. 2014

ISBN

1211-6947

Periodical

Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics"

Year of study

75

Number

75

State

Czech Republic

Pages from

37

Pages to

39

Pages count

40

BibTex

@article{BUT107856,
  author="Tomáš {Vejmola} and Josef {Šandera}",
  title="Detekce poruch pájeného spoje",
  journal="Bulletin of SMT/ISHM Int. Conference {"}New Trends in Microelectronics{"}",
  year="2014",
  volume="75",
  number="75",
  pages="37--39",
  issn="1211-6947"
}