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Publication detail
BULVA, J.
Original Title
Influence of Solder Joint Height to Internal Stress in Multisubstrate Structure
Type
conference paper
Language
English
Original Abstract
This paper is focused on thermomechanical modelling of two substrates with different CTE, which can be used in various types of MSM. There can be used two materials, laminate FR4 and ceramic 96% Al2O3. The interconnection of substrates is done by solder joints, where lead free solder SnAgCu is investigated in this work. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps height is changed.
Key words in English
solder joint quality, thermomechanical modelling
Authors
RIV year
2004
Released
1. 1. 2004
Publisher
Ing. Zdeněk Novotný, CSc. Ondráčkova 105, Brno
Location
Brno
ISBN
80-214-2636-5
Book
Proceedings of the 10th Conference Student EEICT 2004
Pages from
560
Pages to
1123
Pages count
564
BibTex
@inproceedings{BUT10965, author="Jindřich {Bulva}", title="Influence of Solder Joint Height to Internal Stress in Multisubstrate Structure", booktitle="Proceedings of the 10th Conference Student EEICT 2004", year="2004", pages="564", publisher="Ing. Zdeněk Novotný, CSc. Ondráčkova 105, Brno", address="Brno", isbn="80-214-2636-5" }