Detail publikace

Influence of Solder Joint Height to Internal Stress in Multisubstrate Structure

BULVA, J.

Originální název

Influence of Solder Joint Height to Internal Stress in Multisubstrate Structure

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This paper is focused on thermomechanical modelling of two substrates with different CTE, which can be used in various types of MSM. There can be used two materials, laminate FR4 and ceramic 96% Al2O3. The interconnection of substrates is done by solder joints, where lead free solder SnAgCu is investigated in this work. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps height is changed.

Klíčová slova v angličtině

solder joint quality, thermomechanical modelling

Autoři

BULVA, J.

Rok RIV

2004

Vydáno

1. 1. 2004

Nakladatel

Ing. Zdeněk Novotný, CSc. Ondráčkova 105, Brno

Místo

Brno

ISBN

80-214-2636-5

Kniha

Proceedings of the 10th Conference Student EEICT 2004

Strany od

560

Strany do

1123

Strany počet

564

BibTex

@inproceedings{BUT10965,
  author="Jindřich {Bulva}",
  title="Influence of Solder Joint Height to Internal Stress in Multisubstrate Structure",
  booktitle="Proceedings of the 10th Conference Student EEICT 2004",
  year="2004",
  pages="564",
  publisher="Ing. Zdeněk Novotný, CSc. Ondráčkova 105, Brno",
  address="Brno",
  isbn="80-214-2636-5"
}