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BULVA, J.
Originální název
Influence of Solder Joint Height to Internal Stress in Multisubstrate Structure
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
This paper is focused on thermomechanical modelling of two substrates with different CTE, which can be used in various types of MSM. There can be used two materials, laminate FR4 and ceramic 96% Al2O3. The interconnection of substrates is done by solder joints, where lead free solder SnAgCu is investigated in this work. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps height is changed.
Klíčová slova v angličtině
solder joint quality, thermomechanical modelling
Autoři
Rok RIV
2004
Vydáno
1. 1. 2004
Nakladatel
Ing. Zdeněk Novotný, CSc. Ondráčkova 105, Brno
Místo
Brno
ISBN
80-214-2636-5
Kniha
Proceedings of the 10th Conference Student EEICT 2004
Strany od
560
Strany do
1123
Strany počet
564
BibTex
@inproceedings{BUT10965, author="Jindřich {Bulva}", title="Influence of Solder Joint Height to Internal Stress in Multisubstrate Structure", booktitle="Proceedings of the 10th Conference Student EEICT 2004", year="2004", pages="564", publisher="Ing. Zdeněk Novotný, CSc. Ondráčkova 105, Brno", address="Brno", isbn="80-214-2636-5" }