Publication detail

Near threshold fatigue crack growth in ultrafinegrained copper

ARZAGHI, M. FINTOVÁ, S. SARRAZIN-BAUDOUX, C. KUNZ, L. PETIT, J.

Original Title

Near threshold fatigue crack growth in ultrafinegrained copper

Type

journal article in Web of Science

Language

English

Original Abstract

The near threshold fatigue crack growth in ultrafine-grained (UFG) copper at room temperature was studied in comparison to conventional coarse-grained (CG) copper. The fatigue crack growth rates da/dN in UFG copper were enhanced at 7 MPa@m compared to the CG material. The crack closure shielding, as evaluated using the compliance variation technique, was shown to explain these differences. The effective stress intensity factor amplitude

Keywords

fatigue crack rowth, ultrafinegrained Cu

Authors

ARZAGHI, M.; FINTOVÁ, S.; SARRAZIN-BAUDOUX, C.; KUNZ, L.; PETIT, J.

RIV year

2014

Released

8. 8. 2014

Publisher

IOP Publishing

ISBN

1757-8981

Periodical

IOP Conference Series: Materials Science and Engineering

Year of study

63

Number

1

State

United Kingdom of Great Britain and Northern Ireland

Pages from

1

Pages to

9

Pages count

9

URL

http://iopscience.iop.org/article/10.1088/1757-899X/63/1/012158

Full text in the Digital Library

http://hdl.handle.net/11012/137196

BibTex

@article{BUT110695,
  author="Mandana {Arzaghi} and Stanislava {Fintová} and Christine {Sarrazin-Baudoux} and Ludvík {Kunz} and Jean {Petit}",
  title="Near threshold fatigue crack growth in ultrafinegrained copper",
  journal="IOP Conference Series: Materials Science and Engineering",
  year="2014",
  volume="63",
  number="1",
  pages="1--9",
  doi="10.1088/1757-899X/63/1/012158",
  issn="1757-8981",
  url="http://iopscience.iop.org/article/10.1088/1757-899X/63/1/012158"
}