Detail publikace

Near threshold fatigue crack growth in ultrafinegrained copper

ARZAGHI, M. FINTOVÁ, S. SARRAZIN-BAUDOUX, C. KUNZ, L. PETIT, J.

Originální název

Near threshold fatigue crack growth in ultrafinegrained copper

Typ

článek v časopise ve Web of Science, Jimp

Jazyk

angličtina

Originální abstrakt

The near threshold fatigue crack growth in ultrafine-grained (UFG) copper at room temperature was studied in comparison to conventional coarse-grained (CG) copper. The fatigue crack growth rates da/dN in UFG copper were enhanced at 7 MPa@m compared to the CG material. The crack closure shielding, as evaluated using the compliance variation technique, was shown to explain these differences. The effective stress intensity factor amplitude

Klíčová slova

fatigue crack rowth, ultrafinegrained Cu

Autoři

ARZAGHI, M.; FINTOVÁ, S.; SARRAZIN-BAUDOUX, C.; KUNZ, L.; PETIT, J.

Rok RIV

2014

Vydáno

8. 8. 2014

Nakladatel

IOP Publishing

ISSN

1757-8981

Periodikum

IOP Conference Series: Materials Science and Engineering

Ročník

63

Číslo

1

Stát

Spojené království Velké Británie a Severního Irska

Strany od

1

Strany do

9

Strany počet

9

URL

http://iopscience.iop.org/article/10.1088/1757-899X/63/1/012158

Plný text v Digitální knihovně

http://hdl.handle.net/11012/137196

BibTex

@article{BUT110695,
  author="Mandana {Arzaghi} and Stanislava {Fintová} and Christine {Sarrazin-Baudoux} and Ludvík {Kunz} and Jean {Petit}",
  title="Near threshold fatigue crack growth in ultrafinegrained copper",
  journal="IOP Conference Series: Materials Science and Engineering",
  year="2014",
  volume="63",
  number="1",
  pages="1--9",
  doi="10.1088/1757-899X/63/1/012158",
  issn="1757-8981",
  url="http://iopscience.iop.org/article/10.1088/1757-899X/63/1/012158"
}