Publication detail

TECHNOLOGICAL ASPECTS OF REWORK

RIHÁK, P.

Original Title

TECHNOLOGICAL ASPECTS OF REWORK

Type

conference paper

Language

English

Original Abstract

The paper deals with the technological aspects of rework. There are introduced some of these aspects as ambient temperature and ambient humidity, handling and storing devices and components, operators work, reflow soldering thermal profile, influence of flux. Technological aspects negatively influence reliability of soldering process, it is important to pay close attention to this phenomenon. They also have negative influence on repair yield.

Keywords

FLUX, REFLOW SOLDERING THERMAL PROFILE, HANDLING AND STORING, AMBIENT TEMPERATURE, AMBIENT HUMIDITY

Authors

RIHÁK, P.

RIV year

2015

Released

23. 4. 2015

Publisher

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních

Location

Brno

ISBN

978-80-214-5148-3

Book

Proceedings of the 21st Conference STUDENT EEICT 2015

Edition number

1

ISBN

NEUVEDENO

Pages from

396

Pages to

400

Pages count

5

BibTex

@inproceedings{BUT114289,
  author="Pavel {Řihák}",
  title="TECHNOLOGICAL ASPECTS OF REWORK",
  booktitle="Proceedings of the 21st Conference STUDENT EEICT 2015",
  year="2015",
  number="1",
  pages="396--400",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních",
  address="Brno",
  isbn="978-80-214-5148-3"
}