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SZENDIUCH, I. HEJÁTKOVÁ, E.
Original Title
Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Technology Education
Type
conference proceedings
Language
English
Original Abstract
This paper deals with innovative education programme in the microelectronics technology area, containing modern technologies of electronic packaging and interconnection. It is applied at Faculty of Electrical Engineering and Communication in Brno University of Technology.
Keywords
Engineering education, Microelectronics, Electronics hardware, Interdisciplinary subject
Authors
SZENDIUCH, I.; HEJÁTKOVÁ, E.
Released
20. 7. 2015
Publisher
MATE Ltd., Zagreb
Location
Zagreb
ISBN
978-953-246-232-6
Book
International Conference on Engineering Education - New Technologies and Innovation for Global Business
Edition
1
Edition number
NEUVEDENO
Pages from
451
Pages to
457
Pages count
7
BibTex
@proceedings{BUT115458, editor="Ivan {Szendiuch} and Edita {Hejátková}", title="Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Technology Education", year="2015", series="1", number="1", pages="451--457", publisher="MATE Ltd., Zagreb", address="Zagreb", isbn="978-953-246-232-6" }