Publication detail

Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Technology Education

SZENDIUCH, I. HEJÁTKOVÁ, E.

Original Title

Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Technology Education

Type

conference proceedings

Language

English

Original Abstract

This paper deals with innovative education programme in the microelectronics technology area, containing modern technologies of electronic packaging and interconnection. It is applied at Faculty of Electrical Engineering and Communication in Brno University of Technology.

Keywords

Engineering education, Microelectronics, Electronics hardware, Interdisciplinary subject

Authors

SZENDIUCH, I.; HEJÁTKOVÁ, E.

Released

20. 7. 2015

Publisher

MATE Ltd., Zagreb

Location

Zagreb

ISBN

978-953-246-232-6

Book

International Conference on Engineering Education - New Technologies and Innovation for Global Business

Edition

1

Edition number

1

ISBN

NEUVEDENO

Pages from

451

Pages to

457

Pages count

7

BibTex

@proceedings{BUT115458,
  editor="Ivan {Szendiuch} and Edita {Hejátková}",
  title="Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Technology Education",
  year="2015",
  series="1",
  number="1",
  pages="451--457",
  publisher="MATE Ltd., Zagreb",
  address="Zagreb",
  isbn="978-953-246-232-6"
}