Detail publikace

Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Technology Education

SZENDIUCH, I. HEJÁTKOVÁ, E.

Originální název

Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Technology Education

Typ

konferenční sborník (ne článek)

Jazyk

angličtina

Originální abstrakt

This paper deals with innovative education programme in the microelectronics technology area, containing modern technologies of electronic packaging and interconnection. It is applied at Faculty of Electrical Engineering and Communication in Brno University of Technology.

Klíčová slova

Engineering education, Microelectronics, Electronics hardware, Interdisciplinary subject

Autoři

SZENDIUCH, I.; HEJÁTKOVÁ, E.

Vydáno

20. 7. 2015

Nakladatel

MATE Ltd., Zagreb

Místo

Zagreb

ISBN

978-953-246-232-6

Kniha

International Conference on Engineering Education - New Technologies and Innovation for Global Business

Edice

1

Číslo edice

1

ISSN

NEUVEDENO

Strany od

451

Strany do

457

Strany počet

7

BibTex

@proceedings{BUT115458,
  editor="Ivan {Szendiuch} and Edita {Hejátková}",
  title="Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Technology Education",
  year="2015",
  series="1",
  number="1",
  pages="451--457",
  publisher="MATE Ltd., Zagreb",
  address="Zagreb",
  isbn="978-953-246-232-6"
}