Publication detail

Detection of Defects on BGA Solder Balls Using 2D and 3D Methods

ŘIHÁK, P. VALA, R. SZENDIUCH, I.

Original Title

Detection of Defects on BGA Solder Balls Using 2D and 3D Methods

Type

conference paper

Language

English

Original Abstract

The paper is focused on non-destructive X-Ray method used for detection of defects on BGA solder balls. It is possible to use 2D or 3D methods with imaging of individual layers. 2D method is faster and it is used in daily basis. 3D method is less common and it is used for unique defects for further examination. This paper deals with using these methods especially throughout rework process.

Keywords

X-Ray, BGA, defects, detection

Authors

ŘIHÁK, P.; VALA, R.; SZENDIUCH, I.

RIV year

2015

Released

6. 5. 2015

Publisher

Budapest University of Technology and Economics

Location

Hungary

ISBN

978-963-313-177-0

Book

Novel Trends in Electronic Manufacturing - Book of Abstracts 38th International Spring Seminar on Electronics Technology

Pages from

245

Pages to

249

Pages count

5

URL

https://ieeexplore.ieee.org/document/7247999

BibTex

@inproceedings{BUT117450,
  author="Pavel {Řihák} and Radek {Vala} and Ivan {Szendiuch}",
  title="Detection of Defects on BGA Solder Balls Using 2D and 3D Methods",
  booktitle="Novel Trends in Electronic Manufacturing - Book of Abstracts 38th International Spring Seminar on Electronics Technology",
  year="2015",
  pages="245--249",
  publisher="Budapest University of Technology and Economics",
  address="Hungary",
  doi="10.1109/ISSE.2015.7247999",
  isbn="978-963-313-177-0",
  url="https://ieeexplore.ieee.org/document/7247999"
}