Detail publikace

Detection of Defects on BGA Solder Balls Using 2D and 3D Methods

ŘIHÁK, P. VALA, R. SZENDIUCH, I.

Originální název

Detection of Defects on BGA Solder Balls Using 2D and 3D Methods

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

The paper is focused on non-destructive X-Ray method used for detection of defects on BGA solder balls. It is possible to use 2D or 3D methods with imaging of individual layers. 2D method is faster and it is used in daily basis. 3D method is less common and it is used for unique defects for further examination. This paper deals with using these methods especially throughout rework process.

Klíčová slova

X-Ray, BGA, defects, detection

Autoři

ŘIHÁK, P.; VALA, R.; SZENDIUCH, I.

Rok RIV

2015

Vydáno

6. 5. 2015

Nakladatel

Budapest University of Technology and Economics

Místo

Hungary

ISBN

978-963-313-177-0

Kniha

Novel Trends in Electronic Manufacturing - Book of Abstracts 38th International Spring Seminar on Electronics Technology

Strany od

245

Strany do

249

Strany počet

5

URL

https://ieeexplore.ieee.org/document/7247999

BibTex

@inproceedings{BUT117450,
  author="Pavel {Řihák} and Radek {Vala} and Ivan {Szendiuch}",
  title="Detection of Defects on BGA Solder Balls Using 2D and 3D Methods",
  booktitle="Novel Trends in Electronic Manufacturing - Book of Abstracts 38th International Spring Seminar on Electronics Technology",
  year="2015",
  pages="245--249",
  publisher="Budapest University of Technology and Economics",
  address="Hungary",
  doi="10.1109/ISSE.2015.7247999",
  isbn="978-963-313-177-0",
  url="https://ieeexplore.ieee.org/document/7247999"
}