Patent

In accordance with an embodiment, an electrical element includes a first portion of a first dielectric material between a first portion of a first electrical conductor and a first portion of a second electrical conductor and a second portion of the first dielectric material between a second portion of the first electrical conductor and a first portion of a third electrical conductor. In accordance with another embodiment, a method includes forming a first electrically conductive structure over a first portion of the first layer of dielectric material and forming a second electrically conductive structure over a second portion of the first layer of dielectric material. A second layer of dielectric material is formed over the first electrically conductive structure and a third electrically conductive structure over the second layer of dielectric material, wherein the third electrically conductive structure is over portions of the first and second electrically conductive structures.

monolithic; capacitor; demagnetization; sensor; capacitive coupling; on-chip; isolation

20150287774

20. 3. 2015

8. 10. 2015

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

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http://www.patentsencyclopedia.com/app/20150287774