Publication detail

RELIABILITY OF SOLDERED CONNECTION FR-4 AND LTCC VIA SMD

NOVOTNÝ, V. ŠANDERA, J.

Original Title

RELIABILITY OF SOLDERED CONNECTION FR-4 AND LTCC VIA SMD

Type

conference paper

Language

English

Original Abstract

This article deals with the area of solder joints reliability and narrower focus is on interconnetion between FR-4 and low temperature co-fired substrate LTCC via smd part. The text describes the introduction to the issue of reliability of soldered connections and important factors with their influences. These factors also relate with choice of substrates and technological processes of preparation, which are characterized and described. Another part is devoted to the sphere of computer analysis in ANSYS and the specifically. Then are included some options for analysis of reliability. It contains the issue of fatigue models and design of simulation in ANSYS. In conclusion, there are described otuputs of simulations and results obtained from experimental measurements and these are compared and analyzed.

Keywords

INTERCONNECTION, SOLDER JOINT, SAC305, SIMULATION, FATIGUE MODEL, ANSYS

Authors

NOVOTNÝ, V.; ŠANDERA, J.

RIV year

2015

Released

14. 10. 2015

Publisher

Tanger, Ltd.

Location

Ostrava

ISBN

978-80-87294-59-8

Book

Nanocon 2015 Conference proceedings

Pages from

1

Pages to

1

Pages count

9

BibTex

@inproceedings{BUT119642,
  author="Václav {Novotný} and Josef {Šandera}",
  title="RELIABILITY OF SOLDERED CONNECTION FR-4 AND LTCC VIA SMD",
  booktitle="Nanocon 2015 Conference proceedings",
  year="2015",
  pages="1--1",
  publisher="Tanger, Ltd.",
  address="Ostrava",
  isbn="978-80-87294-59-8"
}