Detail publikace

RELIABILITY OF SOLDERED CONNECTION FR-4 AND LTCC VIA SMD

NOVOTNÝ, V. ŠANDERA, J.

Originální název

RELIABILITY OF SOLDERED CONNECTION FR-4 AND LTCC VIA SMD

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This article deals with the area of solder joints reliability and narrower focus is on interconnetion between FR-4 and low temperature co-fired substrate LTCC via smd part. The text describes the introduction to the issue of reliability of soldered connections and important factors with their influences. These factors also relate with choice of substrates and technological processes of preparation, which are characterized and described. Another part is devoted to the sphere of computer analysis in ANSYS and the specifically. Then are included some options for analysis of reliability. It contains the issue of fatigue models and design of simulation in ANSYS. In conclusion, there are described otuputs of simulations and results obtained from experimental measurements and these are compared and analyzed.

Klíčová slova

INTERCONNECTION, SOLDER JOINT, SAC305, SIMULATION, FATIGUE MODEL, ANSYS

Autoři

NOVOTNÝ, V.; ŠANDERA, J.

Rok RIV

2015

Vydáno

14. 10. 2015

Nakladatel

Tanger, Ltd.

Místo

Ostrava

ISBN

978-80-87294-59-8

Kniha

Nanocon 2015 Conference proceedings

Strany od

1

Strany do

1

Strany počet

9

BibTex

@inproceedings{BUT119642,
  author="Václav {Novotný} and Josef {Šandera}",
  title="RELIABILITY OF SOLDERED CONNECTION FR-4 AND LTCC VIA SMD",
  booktitle="Nanocon 2015 Conference proceedings",
  year="2015",
  pages="1--1",
  publisher="Tanger, Ltd.",
  address="Ostrava",
  isbn="978-80-87294-59-8"
}