Publication detail

The Analysis of Solder Preforms in Surface Mount Assembly

NOVOTNÝ, V. ŠANDERA, J. VALA, R.

Original Title

The Analysis of Solder Preforms in Surface Mount Assembly

Type

conference paper

Language

English

Original Abstract

This article is focused on the sphere of solder joints reliability in technology of surface mount assembly and the issue of manufactory of solder joints with solder preforms is introduced closer. It also describes types of solder preforms, their applicaton and different methods of using in surface mount assembly. Text further comprises comparison of the solder joint which is manufactured by printing of solder paste through the cooper stencil and solder joint manufactured by applying of solder preform. The results of these basic processes are compared with method of solder fortification. In conclusion, there are evaluated outputs from experimental manufactory of solder joints with solder preforms and complemented by outputs which are achieved by x-ray machine.

Keywords

Solder, Preforms, Reliability, Fortification, Wettability

Authors

NOVOTNÝ, V.; ŠANDERA, J.; VALA, R.

Released

2. 5. 2016

Publisher

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií

ISBN

978-80-214-5350-0

Book

Proceedings of the 22nd Conference STUDENT EEICT 2016

Pages from

685

Pages to

689

Pages count

5

BibTex

@inproceedings{BUT124794,
  author="Václav {Novotný} and Josef {Šandera} and Radek {Vala}",
  title="The Analysis of Solder Preforms in Surface Mount Assembly",
  booktitle="Proceedings of the 22nd Conference STUDENT EEICT 2016",
  year="2016",
  pages="685--689",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  isbn="978-80-214-5350-0"
}