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NOVOTNÝ, V. ŠANDERA, J. VALA, R.
Originální název
The Analysis of Solder Preforms in Surface Mount Assembly
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
This article is focused on the sphere of solder joints reliability in technology of surface mount assembly and the issue of manufactory of solder joints with solder preforms is introduced closer. It also describes types of solder preforms, their applicaton and different methods of using in surface mount assembly. Text further comprises comparison of the solder joint which is manufactured by printing of solder paste through the cooper stencil and solder joint manufactured by applying of solder preform. The results of these basic processes are compared with method of solder fortification. In conclusion, there are evaluated outputs from experimental manufactory of solder joints with solder preforms and complemented by outputs which are achieved by x-ray machine.
Klíčová slova
Solder, Preforms, Reliability, Fortification, Wettability
Autoři
NOVOTNÝ, V.; ŠANDERA, J.; VALA, R.
Vydáno
2. 5. 2016
Nakladatel
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
ISBN
978-80-214-5350-0
Kniha
Proceedings of the 22nd Conference STUDENT EEICT 2016
Strany od
685
Strany do
689
Strany počet
5
BibTex
@inproceedings{BUT124794, author="Václav {Novotný} and Josef {Šandera} and Radek {Vala}", title="The Analysis of Solder Preforms in Surface Mount Assembly", booktitle="Proceedings of the 22nd Conference STUDENT EEICT 2016", year="2016", pages="685--689", publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií", isbn="978-80-214-5350-0" }