Publication detail

Joining LTCC, Al2O3 and SiC substrates for higher operating temperature applications

SOMER, J. KLÍMA, M. MACHÁČ, P. SZENDIUCH, I.

Original Title

Joining LTCC, Al2O3 and SiC substrates for higher operating temperature applications

Type

conference paper

Language

English

Original Abstract

The article deals with creating solid joints of Low Temperature Co-fired Ceramic with Al2O3 (Alumina) or SiC chips. The aim of this study is to find material of standard thick film layer (TFL) process, which would be useful for electronic chip packages designed for higher operating temperatures (from 150 up to 800 °C).

Keywords

LTCC, thick-film, Al 2O 3, SiC

Authors

SOMER, J.; KLÍMA, M.; MACHÁČ, P.; SZENDIUCH, I.

Released

11. 12. 2016

ISBN

978-80-214-5357-9

Book

Materials Structure & Micromechanics of Fracture (MSMF8)

ISBN

1662-9779

Periodical

Solid State Phenomena

Number

258

State

Swiss Confederation

Pages from

631

Pages to

634

Pages count

4

BibTex

@inproceedings{BUT126860,
  author="Jakub {Somer} and Martin {Klíma} and Petr {Macháč} and Ivan {Szendiuch}",
  title="Joining LTCC, Al2O3 and SiC substrates for higher operating temperature applications",
  booktitle="Materials Structure & Micromechanics of Fracture (MSMF8)",
  year="2016",
  journal="Solid State Phenomena",
  number="258",
  pages="631--634",
  doi="10.4028/www.scientific.net/SSP.258.631",
  isbn="978-80-214-5357-9",
  issn="1662-9779"
}