Detail publikace

Joining LTCC, Al2O3 and SiC substrates for higher operating temperature applications

SOMER, J. KLÍMA, M. MACHÁČ, P. SZENDIUCH, I.

Originální název

Joining LTCC, Al2O3 and SiC substrates for higher operating temperature applications

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

The article deals with creating solid joints of Low Temperature Co-fired Ceramic with Al2O3 (Alumina) or SiC chips. The aim of this study is to find material of standard thick film layer (TFL) process, which would be useful for electronic chip packages designed for higher operating temperatures (from 150 up to 800 °C).

Klíčová slova

LTCC, thick-film, Al 2O 3, SiC

Autoři

SOMER, J.; KLÍMA, M.; MACHÁČ, P.; SZENDIUCH, I.

Vydáno

11. 12. 2016

ISBN

978-80-214-5357-9

Kniha

Materials Structure & Micromechanics of Fracture (MSMF8)

ISSN

1662-9779

Periodikum

Solid State Phenomena

Číslo

258

Stát

Švýcarská konfederace

Strany od

631

Strany do

634

Strany počet

4

BibTex

@inproceedings{BUT126860,
  author="Jakub {Somer} and Martin {Klíma} and Petr {Macháč} and Ivan {Szendiuch}",
  title="Joining LTCC, Al2O3 and SiC substrates for higher operating temperature applications",
  booktitle="Materials Structure & Micromechanics of Fracture (MSMF8)",
  year="2016",
  journal="Solid State Phenomena",
  number="258",
  pages="631--634",
  doi="10.4028/www.scientific.net/SSP.258.631",
  isbn="978-80-214-5357-9",
  issn="1662-9779"
}