Publication detail

STREAMLINING THE PROCESS OF CLEANING PCB AFTER REMOVING BGA

VALA, R. STARČOK, T.

Original Title

STREAMLINING THE PROCESS OF CLEANING PCB AFTER REMOVING BGA

English Title

STREAMLINING THE PROCESS OF CLEANING PCB AFTER REMOVING BGA

Type

conference paper

Language

Czech

Original Abstract

This paper deals with issues connected with solder residues cleaning process of modern BGA packages. First part is focused on contact cleaning method of solder residues. It describes main disadvantages and incurred defects of this method. Second part is focused on a new contactless cleaning method with special tool and then suggests variety of verification possibilities.

English abstract

This paper deals with issues connected with solder residues cleaning process of modern BGA packages. First part is focused on contact cleaning method of solder residues. It describes main disadvantages and incurred defects of this method. Second part is focused on a new contactless cleaning method with special tool and then suggests variety of verification possibilities.

Keywords

BGA, solder, residues, rework

Key words in English

BGA, solder, residues, rework

Authors

VALA, R.; STARČOK, T.

Released

28. 4. 2016

Publisher

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií

Location

Brno

ISBN

978-80-214-5350-0

Book

Proceedings of the 22nd Conference Student EEICT 2016

Pages from

237

Pages to

239

Pages count

777

BibTex

@inproceedings{BUT127137,
  author="Radek {Vala} and Tomáš {Starčok}",
  title="STREAMLINING THE PROCESS OF CLEANING PCB AFTER REMOVING BGA",
  booktitle="Proceedings of the 22nd Conference Student EEICT 2016",
  year="2016",
  pages="237--239",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  address="Brno",
  isbn="978-80-214-5350-0"
}