Detail publikace

STREAMLINING THE PROCESS OF CLEANING PCB AFTER REMOVING BGA

VALA, R. STARČOK, T.

Originální název

STREAMLINING THE PROCESS OF CLEANING PCB AFTER REMOVING BGA

Anglický název

STREAMLINING THE PROCESS OF CLEANING PCB AFTER REMOVING BGA

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

čeština

Originální abstrakt

This paper deals with issues connected with solder residues cleaning process of modern BGA packages. First part is focused on contact cleaning method of solder residues. It describes main disadvantages and incurred defects of this method. Second part is focused on a new contactless cleaning method with special tool and then suggests variety of verification possibilities.

Anglický abstrakt

This paper deals with issues connected with solder residues cleaning process of modern BGA packages. First part is focused on contact cleaning method of solder residues. It describes main disadvantages and incurred defects of this method. Second part is focused on a new contactless cleaning method with special tool and then suggests variety of verification possibilities.

Klíčová slova

BGA, solder, residues, rework

Klíčová slova v angličtině

BGA, solder, residues, rework

Autoři

VALA, R.; STARČOK, T.

Vydáno

28. 4. 2016

Nakladatel

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií

Místo

Brno

ISBN

978-80-214-5350-0

Kniha

Proceedings of the 22nd Conference Student EEICT 2016

Strany od

237

Strany do

239

Strany počet

777

BibTex

@inproceedings{BUT127137,
  author="Radek {Vala} and Tomáš {Starčok}",
  title="STREAMLINING THE PROCESS OF CLEANING PCB AFTER REMOVING BGA",
  booktitle="Proceedings of the 22nd Conference Student EEICT 2016",
  year="2016",
  pages="237--239",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  address="Brno",
  isbn="978-80-214-5350-0"
}